Preprocessing research device (chemical polishing device)
The material thickness is PI 25μm~! We would like to introduce a device that performs surface treatment on both sides of the copper foil.
The device is capable of smoothing the front and back surfaces of copper foil. The lane configuration is 2 lanes, and the processing surfaces are single-sided and double-sided. The device configuration includes unwinding, electrolytic degreasing, acid washing, chemical treatment, acid washing, pure water washing, liquid draining, drying, and winding. 【Specifications】 ■ Lane configuration: 2 lanes ■ Conveying speed: 1.5m to 3.0m/min ■ Material width: For TAB/CSP/COF, 35mm to 160mm (For FPC, 250 to 300mm) ■ Material thickness: PI 25μm and above ■ Processing surfaces: Single-sided and double-sided *For more details, please refer to the PDF document or feel free to contact us.
- Company：SETO ENGINEERING 守谷事業所
- Price：Other
